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HYG528R02386A

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HYG528R02386A
Product Details

Layer : 2L with NPTH

Base Material : CEM3(R-1787) CTI≥600

Board Thickness : 1mm

Final Copper Thickness : 1OZ

Surface Finished : OSP

Unit Size(mm) : 157.99*157.99

Panel Size(mm) : 170.43*508.0

Min W/S(mil) : 16/10

Solder Mask : White

Special Process : Plate Bending&Twist 0.7%

Solder Mask Thickness : Line Angle 8um(min)

V-Cut Remaining Thickness : 0.5mm+0.2/-0mm

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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