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HYG709A01061A

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HYG709A01061A
Product Details

Layer: 1L

Base Material: ALU 1W/MK

Board Thickness: 1.0mm

Final Copper Thickness: 1OZ

Surface Finished: HASL Lead Free

Unit Size(mm): 13.3*13.3

Panel Size(mm): 151.69*289.40

Min W/S(mil): 5.2/6.3

Solder Mask: Black

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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