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HYG709R02047A

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HYG709R02047A
HYG709R02047A
Product Details

Layer : 2L

Base Material : FR4 TG135 CT1>175

Board Thickness : 1.6mm

Final Copper Thickness : 1.5OZ

Surface Finished : HASL Lead Free

Unit Size(mm) : 155.0*86.5

Panel Size(mm) : 169.0*259.5

Min Hole Copper Thickness : 20um

Min W/S(mil) : 9/9.5

Solder Mask : Blue

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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