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HYG718R02015A

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HYG718R02015A
Product Details

Layer: 2L

Base Material: FR4 TG130

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: OSP

Unit Size(mm): 145.5*105.0

Panel Size(mm): 155.5*121.0

Min W/S(mil): 5/5

Min Hole Size: 0.25mm

Solder Mask: Blue

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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