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HYG718R02019B

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HYG718R02019B
Product Details

Carbon Ink PCB

Layer: 2L

Base Material: FR4

Board Thickness : 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: HASL Lead Free+Carbon Ink

Unit Size(mm): 247.0*146.50

Panel Size(mm): 257.0*156.5

Min Hole Size: 0.2mm

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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