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HYG802F02012A

Product Image
HYG802F02012A
HYG802F02012A
Production process

Specification
Code HYG802F02012A Customer?PN


Layer
Blind/Buried?Via NO

Base?Material
Unit?Size(mm)
X
Board?thickness
Panle?Size(mm)
X
Min?hole
Pcs/Panle
X
Total?Holes
Copper?OZ(finish)
Base?Cu
W/S(mil)
Min?Hole?Copper?Thickness


Outline?Finish
Finish?thickness?tolerance


Contour?tolerance
Surface Finishing


X-out
Solder?Mask


Special?request
Silkscreen

Customer Evaluation
20170809113338_62641_副本_副本.jpg 20170809115057_80100_副本.jpg one.jpg 20170809115226_98108_副本.jpg

ISO Certification

UL Certification

Application areas

Who will be our parters

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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