


| Code | HYG812R02023A | Customer PN | / |
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| Layer | 2 | Blind/Buried Via | NO |
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| Base Material | FR4 TG135 | Unit Size(mm) | 20.0000 | X | 250.0000 |
| Board thickness | 1.6MM | Panle Size(mm) | 200.0000 | X | 250.0000 |
| Min hole | 0.38MM | Pcs/Panle | 1 | X | 10 |
| Total Holes | 189 | Copper OZ(finish) | 1OZ | Base Cu | / |
| W/S(mil) | / | Min Hole Copper Thickness | 20um |
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| Outline Finish | CNC+V-CUT | Finish thickness tolerance | +/-10% |
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| Contour tolerance | +/-0.15MM | Customer' Specifications | HYG |
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| X-out | 2 | Solder Mask | White |
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| Special request | Solder mask thickness:10um(min) | Silkscreen | Black |
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.