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HYG812R02023A

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HYG812R02023A
HYG812R02023A
Product Details


Production process

Specification
Code HYG812R02023A Customer PN /

Layer 2 Blind/Buried Via NO

Base Material FR4 TG135 Unit Size(mm) 20.0000 X 250.0000
Board thickness 1.6MM Panle Size(mm) 200.0000 X 250.0000
Min hole 0.38MM Pcs/Panle 1 X 10
Total Holes 189 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 20um

Outline Finish CNC+V-CUT Finish thickness tolerance +/-10%

Contour tolerance +/-0.15MM Customer' Specifications HYG

X-out 2 Solder Mask White

Special request Solder mask thickness:10um(min) Silkscreen Black

ISO Certification

UL Certification

Application areas

Who will be our parters

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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