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HYG882R14020A

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HYG882R14020A
Product Details

Layer: 14L

Base Material: FR4

Board Thickness: 2.13mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG+Impedance control

Unit Size(mm): 140.0*127.0

Panel Size(mm): 165.4*152.4

Min W/S(mil): 3.8/4.0

Min Hole Size: 0.2mm

Solder Mask Thickness: 10-50um

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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