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HYG885A01021A

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HYG885A01021A
Product Details

Layer : 1L

Base Material : ALU 1.5W/MK

Board Thickness : 1.565mm

Surface Finished : ENIG

Unit Size(mm) : 293.5*279.5

Solder Mask : Black

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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