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HYG885R02026A

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HYG885R02026A
Product Details

Layer: 2L

Base Material: FR4 TD≥320℃

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: HASL Lead Free+Peelable Mask

Unit Size(mm): 51.0*51.0

Panel Size(mm): 250.0*180.0

Min Hole Size: 0.3mm

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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