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HYG898A01273A

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HYG898A01273A
Product Details

Layer: 1L

Base Material: ALU Thermal Conductivity>2W/MK

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: HASL Lead Free

Unit Size(mm): 216.0*216.0

Panel Size(mm): 226.0*226.0

Solder Mask: White

Medium Thickness Minimum 150um

Breakdown Voltage>750V/mil

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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