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HYG898R06270A | ITEQ

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HYG898R06270A | ITEQ
Product Details

Layer: 6L

Base Material: ITEQ

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 155.19*86.75

Panel Size(mm): 172.21*284.61

Min W/S(mil): 6/6

Min Hole Size: 0.25mm

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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