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Products

HYG902R04025A

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HYG902R04025A
HYG902R04025A
Product Details

Layer : 4L

Base Material : FR4 TG170

Board Thickness : 1.575mm

Final Copper Thickness : 2/1/1/2OZ

Surface Finished : ENIG

Unit Size(mm) : 95.25*234.95

Panel Size(mm) : 95.25*234.95

Min Hole Copper Thickness : 20um

Min W/S(mil) : 9.8/9.8

Solder Mask Thickness : min 10um

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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