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HYG904R04002A

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HYG904R04002A
HYG904R04002A
Product Details

Layer : 4L

Base Material : FR4,TG150

Board Thickness : 2.34mm

Final Copper Thickness : 1OZ

Surface Finished : ENIG

Unit Size(mm) : 187.96*119.38

Panel Size(mm) : 203.2*279.4

Min Hole Copper Thickness : 20um

Min Hole Size : 0.3mm

Min W/S(mil) : 7.5/7.4

Solder Mask : Blue

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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