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HYG904R04004B

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HYG904R04004B
Product Details

Layer: 4L

Base Material: FR4 TG150

Board Thickness: 1.575mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 127.0*218.4

Panel Size(mm): 274.3*238.7

Min W/S(mil): 5/10

Outline Finish: V-CUT

Solder Mask: Blue

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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