Rigid-flex PCB|HYG306RF06016A

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Product Details

Layer: 6L

Base Material: FR4(TG170)+PI

Board Thickness: 1.08mm

Final Copper Thickness: 1oz

Surface Finished: ENIG

Unit Size（mm）：140.0*50.0

Panel Size（mm）：140.0*200.0

Min Hole Size : 0.12mm

Min Hole Copper Thickness : 20um

Min W/S(mil): 3.94/3.94

Solder Mask: green

Coverlay: yellow

ISO Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.