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blind and buried vias PCB

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blind and buried vias PCB
Product Details
Layer: 6L
Base Material: FR4 TG171
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Impedance Control
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4/5.37
Min Hole Size: 0.15mm
L1-L3, L3-L4, L4-L6 have blind and buried vias
Production Process

ISO Certification

UL Certification

Application areas

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FAQ
  • What’s your quality standard? What’s certificates do you have?
  • Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001,ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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