HYG601R04003A

Bild

Beschreibung

Special Request: IPC-4761 Type IV
Layer: 4L
Base Material: FR4 TG≥150℃
Board Thickness: 1.64mm
Final Copper Thickness: 78.7um
Surface Finished: ENIG
Unit Size(mm): 133.80*182.30
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.3mm

Production Process

ISO-Zertifizierung

UL-Zertifizierung

Anwendungsbereiche

Wer wird unser Partner sein?

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~50 Layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Kontaktiere uns

Willkommen auf der HOYOGO-Website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel .: (+86) -755-2300 1582

Fax: (+86) -755-2720 6126

E-Mail: sales@hygpcb.com