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HYG2685R02028A

Image
HYG2685R02028A
La description
Layer: 2L
Base Material: FR4,CTI>175
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead
Unit Size(mm): 105.00*85.80
Min. W/S(mil): 9.84/7.87
Production Process

Cutting1.jpg
Cutting
Chemical&Physical Laborato.jpg
laboratory
Inner Dry Film Imaging.jpg
Dry Film
Inner layer etch.jpg
Inner Etching
Auto Drill Bit Sharpener.jpg
Auto Drill Bit Sharpener
Drilling (Auto Drilling machine).jpg
Drilling
PTH & Surface Copper Measu.jpg
PTH
Panel plating.jpg
Panel Plating
HASL Line (Lead and Lead.jpg
HASL Lead Free
ENIG Thickness
Immersion Gold
Solder Mask.jpg
Solder Mask
Auto E-test Machine.jpg
E-test
Routing.jpg
Profile
FQC.jpg
FQC
AOI Test.jpg
AOI Sacning
Inspection Machine.jpg
Inpection Machine
Final Audi.jpg
Final Audi
packing.jpg
Packing


Certification ISO

Certification UL

Zone d'application

Qui seront nos partenaires

FAQ
  • What’s your most advantage of your supply?
  • @Standard mass production (>50sqm) from 1~50 Layer can be with very good price.
    @ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
    @ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contactez nous

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tél: (+86) -755-2300 1582

Télécopie: (+86) -755-2720 6126

Courriel: sales@hygpcb.com

Address: A / 7 étage, Immeuble Kechuang,Parc d'innovation scientifique et technologique de Quanzhi, Shajing Street, District de Bao'an, Shenzhen 518104/ P.R.C.


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