Accueil Des produits Circuit imprimé rigide

HYG601R04003A

Image

La description

Special Request: IPC-4761 Type IV
Layer: 4L
Base Material: FR4 TG≥150℃
Board Thickness: 1.64mm
Final Copper Thickness: 78.7um
Surface Finished: ENIG
Unit Size(mm): 133.80*182.30
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.3mm

Production Process

Certification ISO

Certification UL

Zone d'application

Qui seront nos partenaires

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~50 Layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contactez nous

Bienvenue sur le site HOYOGO!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tél: (+86) -755-2300 1582

Télécopie: (+86) -755-2720 6126

Courriel: sales@hygpcb.com

Address: A / 7 étage, Immeuble Kechuang,Parc d'innovation scientifique et technologique de Quanzhi, Shajing Street, District de Bao'an, Shenzhen 518104/ P.R.C.