HYG088R02045C

Product Image

Product Details

Special Request:
1.Solder Mask Ink: H9100 MG31
2.Solder Mask Thickness: Min. 10 um

Layer: 2L
Base Material: FR4 S1000-2
Board Thickness: 0.9mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 9.00*22.00
Min. W/S(mil): 11.8
Solder Mask: Green matt

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~50 Layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com