HYG3003R02016A

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Product Details

Special Request: White Solder Mask Ink: Mekamei LE-600X

Layer: 2L
Base Material: FR4 CTI≥175
Board Thickness: 1.60mm
Final Copper Thickness: ＞65um
Surface Finished: HASL Lead Free
Unit Size(mm): 17.80*300.00
Min. W/S(mil): 9.8/15.7
Solder Mask: White

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have a price list?
PCB is customized product; all prices will depend on customer actual gerber data and qty request, it will be difficult to provide it.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com