HYG500RF04009A

Product Image

Product Details

Layer: 4L
Base Material: FR4(Halogen Free)+100um PI
Board Thickness: Rigid Section: 0.86mm±0.1mm
Flex Section: 0.25mm±0.05mm
Outer Copper: 35um
Inner Copper: 1OZ
Surface Finished: ENIG
Unit Size(mm): 40.70*13.95
Min. W/S(mil): 6/5.99mil
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow Coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer FOB HK?
We have truck to HONGKONG every day. It will request MOV per shipment due to the local charge. Or we can shift with FOB and FCA according to order value.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com