HYG522R06001A

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Product Details

Special Request:
1. CAF resistance tested in accordance with IPC-TM-650.
2. Ionic contamination: <0.6 μg NaCl/cm²; free of PBB and PBDE.
3. Critical dimensions controlled to Cpk≥1.33, per drawing requirements.
4. Press-fit holes.
5. Board warpage ≤ 0.5%.
6. Continuous operating temperature: 120°C. Continuous operating voltage: 950V.

Layer: 6L
Base Material: FR4 TG175℃, CTI>175(S1000-2M)
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: >33.4um
Inner Layer Final Copper Thickness：>24.9um
Surface Finished: Immersion Tin
Unit Size(mm): 231.00*280.00
Min. W/S(mil): 5.9/5
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer the third-party service, to make shipment direct to end customer but without documents (invoice)?
Yes, from our carrier partners, DHL, UPS, FEDEX, we have signed this service. And our forwarder by air or sea shipment can support this too.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com