HYG805R06004A

Product Image

Product Details

Special Request: ENIG Gold Thickness: 3u"-7u"

Layer: 6L
Base Material: FR4 TG≥170℃, IPC-4101/24
Board Thickness: 1.575mm
Outer Copper Thickness: ≥33.4um
Inner Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 152.40*127.00
Min. W/S(mil): 4/5
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have Hongkong office? Why when we order to you, the address needs to be Shenzhen.
YES, our registering and accounting address is Hongkong. But for the official business, we will handle in Shenzhen.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com