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HYGBT003

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HYGBT003

Product Details

Special Request:
1. Crystal Point: 21280
2. Spacing: 0.03 mm Min.
3. Hole Diameter: 0.06 mm (85,120 Holes)
4. Laser-Drilled Blind Vias
5. Full-Panel Electroplated Via Filling

Min. Line Width: 0.04 mm
Plating Process: ENIG
Gold/Silver/Nickel Thickness: 2 U" / ** / 150 U"
Board Thickness: 0.1 ± 0.03 mm
Board Size: 110 x 110 mm

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ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 8F, Second-A Building, Daji Hui Innovation Industrial Center, Shajing Street Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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