HYGBT005

Product Image

Product Details

Special Request:
1. Crystal Point: 32
2. Spacing: 2 Mil Min.
3. Electroplated Via Filling
4. Cover Layer Lamination
5. Laser-Drilled Through Holes

Min. Line Width: 5.9 mil
Plating Process: ENEPIG
Palladium/Nickel/Gold Thickness: 2 / 150 / 2 U"
Board Thickness: 0.54 ± 0.03 mm
Board Size: 129 x 70 mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your standard delivery time?
Our standard delivery time will be 2weeks for 2L, 3weeks for multilayer according to production volume and customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com