HYG601R04003A
Cenário
Descrição
Special Request: IPC-4761 Type IV
Layer: 4L
Base Material: FR4 TG≥150℃
Board Thickness: 1.64mm
Final Copper Thickness: 78.7um
Surface Finished: ENIG
Unit Size(mm): 133.80*182.30
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.3mm
Production Process
Certificação ISO
Certificação UL
Áreas de aplicação
Quem serão nossos parceiros
Perguntas frequentes
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What’s your most advantage of your supply?
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@Standard mass production (>50sqm) from 1~50 Layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.
Contate-Nos
Bem-vindo ao site da HOYOGO!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel: (+86) -755-2300 1582
Fax: (+86) -755-2720 6126
E-mail: sales@hygpcb.com
Endereço: Piso A / 7, Edifício Kechuang, Parque de Inovação em Ciência e Tecnologia de Quanzhi, Rua Shajing, Distrito de Bao'an, Shenzhen 518104/ P.R.C.