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Produtos

HYG623R02001B

Cenário
HYG623R02001B
Descrição
Layer: 2L
Base Material: FR4, CTI 175
Board Thickness: 1.60mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 59.50*42.00
Min. W/S(mil): 8/8.8
Min. Hole Size: 0.3mm
Production Process
Cutting1.jpg
Cutting
Chemical&Physical Laborato.jpg
laboratory
Inner Dry Film Imaging.jpg
Dry Film
Inner layer etch.jpg
Inner Etching
Auto Drill Bit Sharpener.jpg
Auto Drill Bit Sharpener
Drilling (Auto Drilling machine).jpg
Drilling
PTH & Surface Copper Measu.jpg
PTH
Panel plating.jpg
Panel Plating
HASL Line (Lead and Lead.jpg
HASL Lead Free
ENIG Thickness
Immersion Gold
Solder Mask.jpg
Solder Mask
Auto E-test Machine.jpg
E-test
Routing.jpg
Profile
FQC.jpg
FQC
AOI Test.jpg
AOI Sacning
Inspection Machine.jpg
Inpection Machine
Final Audi.jpg
Final Audi
packing.jpg
Packing


Certificação ISO

Certificação UL

Áreas de aplicação

Quem serão nossos parceiros

Perguntas frequentes
  • Will you take charge of the cost in case of a claim for defected PCB or assembled PCB (PCBA)?
  • HoYoGo has strict quality system and standard for our outgoing PCBs and responsible for them after service. In case there is claim, we will give quick response in 30minutes. If it’s our PCB’s defect after analysis, we will give solution and pay all the related cost.

Contate-Nos

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel: (+86) -755-2300 1582

Fax: (+86) -755-2720 6126

E-mail: sales@hygpcb.com

Endereço: Piso A / 7, Edifício Kechuang, Parque de Inovação em Ciência e Tecnologia de Quanzhi, Rua Shajing, Distrito de Bao'an, Shenzhen 518104/ P.R.C.


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