Layer: 2L with NPTH ; Base Material: FR4 ; Board Thickness: 1.0mm ; Final Copper Thickness: 2OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 228.0*144.0 ; Panel Size(mm): 228.0*144.0 ; Solder Mask: Green+White ; Solder Mask Thickness : Min 20um ; 1.0±0.1mm without copper core board ;