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Blind&Buried Via ; Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 25.6*16.0 ; Panel Size(mm) : 187.0*268.0 ;
https://www.hoyogo.com/Products/HYG089R06036A.htmlLayer: 6L Base Material: FR4 TG171 Board Thickness: 1.54mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 90.0*50.0 Panel Size(mm): 195.0*102.0 Min W/S(mil): 3.4/5.37 Min Hole Size: 0.15mm L1-L3, L3-L4, L4-L6 have blind and buried vias
https://www.hoyogo.com/blind-and-buried-vias-PCB.html
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