16L PCB|HYG531R16001A|TU 768

Product Image

Product Details

Layer : 16L

Base Material : TU-768

Board Thickness : 1.57±0.1mm

Final Copper Thickness: 20um

Surface Finished : ENIG+Golden Finger

Special Process : Via Plug with Resin, Cap Plating

Impedance Control

Single Impedance : 14 group

Differential Impedance : 13 group

Set Size : 266.7*139.71mm

Unit Size : 266.7*139.71mm

Min Hole Aperture : 0.2mm

Min Line Width : 3.5mil

Min Line Spacing : 4.3mil

Solder Mask Brand: LP-4G/R36

Solder Mask Color : Red

ISO Certification

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.