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HYG089R02065A

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HYG089R02065A
HYG089R02065A
Production process


Specification
Code HYG089R02065A Customer PN


Layer 2 Blind/Buried Via NO

Base Material FR4 Unit Size(mm) 26.0000 X 26.0000
Board thickness 1
 Panle Size(mm) 155.0000
 X 221.0000
Min hole 0.3mm
 Pcs/Panle 4 X 6
Total Holes 1656/SET Copper OZ(finish) 1OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 20um

Outline Finish CNC Finish thickness tolerance +/-10%

Contour tolerance +/-0.15mm Surface Finishing
 HASL Lead Free

X-out / Solder Mask Black

Special request / Silkscreen White

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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