HYG021R04022A | BGA

Product Image


BGA PCB



Product Details


Layer: 4L

Base Material: FR4 TG130

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 50.0*71.5

Panel Size(mm): 74.5*219.0

Min W/S(mil): 8/8

Min Hole Size: 0.2mm

Special Request: BGA



IOS Certification



UL Certification



Application areas



Who will be our parters



FAQ


Can you update a WIP to us every day?

Yes, no problem. We can update it to you every day or every couple of days depends on customer request.



Contact Us


Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.



HOYOGO


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