HYG1281F02011A

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FR4 Stiffener FPC

FR4 Stiffener



Product Details


Layer: 2L

Base Material: PI

Board Thickness: 0.22mm

Final Copper Thickness1OZ

Surface Finished: ENIG

Unit Size(mm): 61.3*46.0

Panel Size(mm): 290.0*172.6

Min W/S(mil): 7.9/7.8

Min Hole Size: 0.3mm

Solder Mask: Yellow Coverlay

Special Request: FR4 Stiffener+3M Tape



IOS Certification



UL Certification



Application areas



Who will be our parters



FAQ


Is there UL certificate for your flexible board?

YES. We can offer UL certificate of FPC.



Contact Us


Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.



HOYOGO


Keywords:FR4 Stiffener,FR4 Stiffener PCB,3M Tape FPC