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HYG293C01355A

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HYG293C01355A
Product Details

Layer: 1L

Base Material: Copper Base

Board Thickness: 1.5mm

Final Copper Thickness: 1OZ

Surface Finished: OSP

Unit Size(mm): 18.5*18.5

Panel Size(mm): 185.0*158.0

Min W/S(mil): 10/7.9

Solder Mask: PM-500WD-85SF

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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