HYG293R04347A

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Via Plug With Resin


Product Details


Layer: 4L

Base Material: FR4

Board Thickness: 1.5mm

Final Copper Thickness1OZ

Surface Finished: ENIG

Unit Size(mm): 76.16*77.90

Panel Size(mm): 176.0*180.0

Min W/S(mil): 7.9/7.8

Min Hole Size: 0.3mm

Special Request: Via Plug With Resin



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UL Certification



Application areas



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FAQ


What’s your main material type?

KB, SY, NY, ITEQ, TUC, Ventec, etc.


Contact Us


Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.



HOYOGO


Keywords:Via Plug With Resin,PCB resin plug via,PCB resin plug