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Customer service hotline:+86 13723413985 or 400 058 2288
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Item |
Standard (Mass Production) |
Advanced (Sampling) |
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Layer Counts |
1-28 Layers |
30-100 Layers |
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Final Board Thickness |
0.3-3.2mm |
0.15-7mm |
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Max. Panel Size |
508mm x 640mm |
610mm x 1400mm |
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Available Laminates Material |
CEM-3, FR-4, (High TG, High CTI, HalogenFree, high frequency), Metal base, Ceramic, Glass base. |
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Material Supplier |
KB, SY, NY, ITEQ, TUC |
Rogers, Arlon, Taconic, Nelco... |
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Surface Finish |
LF-HASL, OSP, ENIG, Immersion Silver, Immersion Tin |
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Impedance Control |
±10% ohm |
±10% ohm |
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Min. Line Width / Space |
3/3mil |
3/2.5mil |
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Max. Aspect Ratio |
10:1 |
30:1 |
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Copper Thickness |
Standard: 18um, 35um, 70um, 105um, 140um |
140um(inner layer)~280um(outer layer) |
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Min. Finished Hole Size |
0.2mm |
0.1mm |
Special Techniques ‐ Blind & Buried via, via in pad, hard gold and gold fingers, Flash gold, Ni/Pd/Au finish, Edge plating, Depth control routing, Countersunk holes, etc.
Special Services – FPC, Rigid-flex, quick turn, heavy copper mass production, IMS boards(Copper, Alu, Steel), Glass base PCB.
PCBA Assembly Services – Medium and small volume, mass production.
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Item |
Flexible PCB |
Rigid-Flex PCB |
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Material |
PI, PET |
PI + FR4 |
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Layers |
1-12 |
2-32 |
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Base Copper Thickness |
1/4OZ-2OZ |
1/4-2OZ for flex, 1/4OZ-4OZ for rigid |
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Board Thickness(Min.) |
Single-sided |
0.05mm |
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Double-sided |
0.10mm |
0.20mm |
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Board Dimension(Max.) |
500mm x 1000mm |
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Width/Space(Min.) |
Copper Weight: up to 0.2OZ |
0.04mm |
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Copper Weight: up to 0.5OZ |
0.06mm |
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Copper Weight: 0.5 - 1OZ |
0.075mm |
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Copper Weight: over 1OZ |
0.10mm |
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Via Type |
Through hole, blind, buried |
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Silkscreen Width/Space(Min.) |
0.10mm |
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Solder Mask Bridge(Min.) |
0.20mm for coverlayer, 0.12mm for LPI |
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Hole(Min. ) |
Drilled |
0.15mm |
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Punched |
0.5mm |
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Min. Slot |
0.5mm(Punching), 0.8mm(Routing) |
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Dimension Tolerance |
Line Width |
±0.03mm(W≤0.3mm), ±10%(W>0.3mm) |
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Hole |
±0.05mm(NPTH), ±0.75mm(PTH) |
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Outline |
±0.10mm, Special±0.05mm with high-precise hard tool |
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Conductor to Outline |
±0.10mm, Special±0.05mm with high-precise hard tool |
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Surface Treatment |
Ni / Au Plating |
Ni: 2-8um(80-320u") Au: 0.05-2um(2-80u") |
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Electroless Nickel Immersion Gold(ENIG) |
Ni: 2-6um(80-240u") Au: 0.05-0.10um(2-4u") |
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Tin Plating |
5-20um |
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Immersion Silver |
0.2-0.4um |
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Immersion Tin |
1um(min.) |
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OSP |
0.2um(min.) |
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Hard Gold |
Hardness over 150HV |
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Others |
Gold Plating+ENIG; ENIG+OSP; ENEPIG |
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