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Products

HYG511F02006A

Product Image
HYG511F02006A
Product Details
Gold Finger FPC
Special Request:
Each unit has 2 pieces stiffener with PI material,
T=0.3+/-0.03mm. 

Layer: 2L
Base Material: PI 25um
Board Thickness: 0.3mm
Final Copper Thickness: 18um
Surface Finished: ENIG
Unit Size(mm): 20.50*150.00
Min W/S(mil): 3.93/5.5
Min Hole Size: 0.15mm
Solder Mask: Yellow coverlay
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you produce board of gold finger?
  • Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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