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HYG511F02007A

Product Image

HYG511F02007A

Product Details

Gold Finger FPC
Special Request:
Each unit has 2 pieces stiffener with PI material,
T=0.3+/-0.03mm.

Layer: 2L
Base Material: PI 25um
Board Thickness: 0.3mm
Final Copper Thickness: 18um
Surface Finished: ENIG
Unit Size(mm): 20.50*98.00
Min. W/S(mil): 3.93/5.5
Min. Hole Size: 0.15mm
Solder Mask: Yellow coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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