HYG7777R06003A

Product Image

Product Details

Special Request:
1. There are blind and buried vias between layers L1–L3, L3–L4, and L4–L6.
2. Impedance Control.

Layer: 6L
Base Material: FR4 TG170℃(S1000-2m)
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.00*50.00
Min. W/S(mil): 3.4/5.37
Min. Hole Size: 0.15mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com