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4 L FR4 TG>=150 TD>=320 1.6mm

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4 L FR4 TG>=150 TD>=320 1.6mm
Product Details

[Product details]


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Layer: 4  Base Material: FR4 TG>=150 TD>=320
Board thickness: 1.6mm Unit Size(mm): 119 x 247
Min hole size: 0.6mm Panel Size(mm): 257 x 240
Total hole: 1017/SET W/S(mil): 15/9.7
Copper OZ: 3OZ Surface finishing: ENIG Thickness& Peelable mask
Solder Mask: Green

Silkscreen:White



[Quotation]


Cu P/N PCB 45825
Nuber of Layer

Unless otherwise noted on the fabrication drawing, the minimum dielectric separation between any adjacent conductive layers shall be 300um, minimum 

and there shall be no less than two sheets of dielectric material used 

between each pair of adjacent conductive layers.

Thickness PCB  1.6mm + -10%
Thickness Cu Finish OUTER min. 3OZ (105 micron) Inner   2OZ   (70 micron)
Material FR4 DT>=320C (Decomposition temperature) TG150
Size/Panel  257 X 240 mm    
Format File Ucam DPF
Finish

ENIG(Au>=0.05um-Ni>=3um)-Solder Mask(Color Green)-Silkscreen

White Top- V-CUT- Routing-100% E-TEST-PEELABLE BOTTOM

Q.TY See the order






Attention:

- You don't insert you r firm Logo and your UL logo

- Drill tolerance(unless specified) PTH+0.10/-0.05mm, NPTH+ -0.05mm, Press-FIT+ -0.05mm

- General machanical tolerance (Unless specified) + -0.10mm  by Routing process

- V-cut core 0.40mm +/-0.1

- General requirements compliant to IPC A600 class 2/IPC 6012 class2(latest revisions)

- You have to compile the datecode (week-year of production) on solder mask bottom



[Featurer]


Degreasing

ü Degreasing: Removal of grease and oxides on copper surfaces

ü Parameter control


Main components

Process range

ACL-702

80-120ml/l

Time

4’35“-5’

Temperature

30-50℃


Micro-etching

ü Silicon micro-etching: increase the roughness of the copper surface

ü Parameter control


Main project

Process range

NaPS

50-90ml/l

H2SO4

10-30ml/l

Cu2+

2-20g/l

Time

1’30“

Temperature

25-30℃


Pickling

Pickling: Removes residual SPS from copper surfaces

Parameter control


Main components

Process range

H2SO4

40-60ml/l

Time

50“~1’10”

Temperature

Normal temperature


Pre-preg

Main project

Process range

H2SO4

10-30ml/l

Time

30



[Technical Advantages]


1. Due to the different crystal structure formed by Immersion Gold and Gold Plating, Immersion Gold will be yellower than Gold Plating and customers will be more satisfied.

2. Because the crystal structure formed by Immersion Gold and Gold Plating is not the same, Immersion Gold is easier to weld than Gold Plating, which will not cause bad welding and cause customer complaints.

3. Since there are only nickel gold on the pads of the gold sink, the signal transmission in the skin effect will not affect the signal in the copper layer.

4, due to the gold than the gold plating crystal structure is more dense and difficult to produce oxidation.

5, due to the gold plate only nickel gold on the pad, it will not produce gold wire caused by the micro-short.

6, due to the gold plate only the nickel pad on the pad, so the line of solder and the copper layer more firmly.

7. The project will not affect the spacing when making compensation.

8, due to the formation of gold and gold plated crystal structure is not the same, the stress of the gold plate is more easily controlled, for a bonded product, it is more conducive to the bonding process. At the same time, because the gold is more gold-plated than the gold-plated one, the gold-fingered gold finger does not wear.

9. The flatness and service life of the gold plate are as good as the gold plate.


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ISO Certification

UL Certification

Application areas

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Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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