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HYG293R01358A

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HYG293R01358A
Product Details

Layer: 1L

Base Material: CEM-3(KB7150) CT1≥175

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: HASL Lead Free

Unit Size(mm): 342.4*25.0

Panel Size(mm): 342.4*141.0

Min W/S(mil): 11.8

Solder Mask: PM-500WD-85SF

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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