PM-500WD-85SF

HYG293R01358A

Layer: 1L ; Base Material: CEM-3(KB7150) CT1≥175 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 342.4*25.0 ; Panel Size(mm): 342.4*141.0 ; Min W/S(mil): 11.8 ; Solder Mask: PM-500WD-85SF ;