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HYG885R02011A

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HYG885R02011A
Product Details

Thick Copper PCB

Layer: 2L

Base Material: FR4 TG170

Board Thickness : 2.0mm

Surface Finished: ENIG

Unit Size(mm): 202.0*168.0

Solder Mask: Green Matt

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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