Layer : 3L
Base Material : FR4
Board Thickness : 3.2mm
Final Copper Thickness : 1OZ
Surface Finished : HASL Lead Free+Depth milling
Unit Size(mm) : 24.0*36.35
Panel Size(mm) : 228.1*103.0
Min Hole Copper Thickness : 20um
Min W/S(mil) : 15.75/12
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.