Layer : 3L ; Base Material : FR4 ; Board Thickness : 3.2mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free+Depth milling ; Unit Size(mm) : 24.0*36.35 ; Panel Size(mm) : 228.1*103.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 15.75/12 ;
https://www.hoyogo.com/Products/HYG892R03134B.htmlDepth Milling PCB Layer: 4L Base Material: FR4 TG150 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: HASL Lead Free+Peelable Mask Unit Size(mm): 52.0*52.0 Panel Size(mm): 254.0*180.0 Min W/S(mil): 7/8 Min Hole Size: 0.2mm&nbs...
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