SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO., LTD. in providing overall PCBA electronic manufacturing services, and can also provide customers with a full range of value-added services: including SMT, PCB solution development, schematic design, PCB layout and routing, Bom list matching, component procurement and other services.
How to correctly choose PCBA processing technology for circuit board processing:
1. Single-sided SMT
After adding solder paste is added to the component pads, after the solder paste printing of the bare PCB is completed, the relevant electronic components are installed through reflow soldering paste, and then reflow soldering is performed.
2. Single-sided DIP Plug-in Mounting
The PCB board that needs to be plug-in is wave soldered by the production line workers after inserting the electronic components, and the board can be washed after the soldering is fixed, but the wave soldering production efficiency is low.
3. Single-sided Mixed Mounting
The PCB board is printed with solder paste, and the electronic components are mounted and then fixed by reflow soldering. After the quality inspection is completed, perform DIP insertion, and then perform wave soldering or manual welding. Manual welding is recommended if there are fewer through-hole components.
4. Single-sided SMT and Plug-in Mixing
Some PCB boards are double-sided, one side is mounted and the other side is inserted. The process flow of mounting and inserting is the same as single-sided processing, but the PCB board needs to use jigs for reflow soldering and wave soldering.
5. Double-sided SMT
In order to ensure the aesthetics and functionality of the PCB board, some PCB design engineers will adopt a double-sided mounting method. IC components are arranged on side A and chip components are mounted on side B. Make full use of the PCB board space to achieve a small PCB board area.
6. Double-sided Mixed Loading
The following are two methods of double-sided mixed loading:
The First method: PCBA processing and assembly require three times of heating, which is low in efficiency, and also requires red glue process wave soldering, which has a low pass rate, so it is not recommended.
The Second Method: It is suitable for situations where there are many double-sided SMD components and few THT components. Manual welding is recommended.