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Problems and Countermeasures of PCB Circuit Board Copper-clad Laminate

2020/06/19 20:12:00

Here are some of the most frequently encountered PCB laminate problems, and how to confirm them. Once you encounter problems with PCB laminates, you should consider increasing the PCB laminate specifications.

 

 

First: To be able to track and find.

Without encountering some problems, it is impossible to manufacture any number of PCBs. This is mainly due to the material of the PCB copper-clad laminate. When quality problems occur in the actual manufacturing process, it seems that it is usually because the PCB substrate material becomes the cause of the problem.

 Generally, if this technical specification is not perfected, it will lead to continuous quality changes and consequently lead to product scrapping. Manufacturers using different batches of raw materials or products manufactured with different pressing loads will experience material problems caused by PCB laminate quality changes. Few users can save a large number of sufficient records, so they can distinguish the specific pressing load or batch of materials at the processing site. Therefore, it is often the case that PCBs continuously produce and mount components, and warpage is continuously generated in the tin bath, thereby wasting a lot of labor and expensive components. If the batch number of the charge can be checked immediately, the PCB laminate manufacturer can check the batch number of the resin, the batch number of the copper foil, the curing cycle, etc. In other words, if the user cannot provide the continuity of the PCB laminate manufacturer's quality control system, this will cause the user to suffer long-term losses. The following describes the general issues related to substrate materials in the PCB manufacturing process.

 

 

Second: What are the surface?

Symptoms: The adhesion of the printed material is poor, the adhesion of the coating is poor, some parts cannot be etched away, and some parts cannot be welded.

Available inspection methods: Visual inspection is usually performed by forming a visible watermark on the surface of the circuit board:

 

 

Possible Reason:

1. The surface caused by the release film is very dense and smooth, the uncoated surface is too bright.

2. Normally on the uncoated side of the laminate, the laminate manufacturer will not remove the release agent.

4. The copper foil manufacturer added an excessive amount of antioxidant on the surface of the copper foil.

5. The manufacturer of the laminate changed the resin system, peeling method or painting method.

5. The manufacturer of the laminate changed the resin system, peeling method or painting method.

6. Due to improper operation, there are many fingerprints or grease.

7. Dip the machine oil during punching, cutting or drilling operations.

 

 

Possible Solutions:

1. Before changing the laminate manufacturing, please cooperate with the laminate manufacturer and specify the user's test items.

2. It is recommended that laminate manufacturers use fabric-like films or other insulation materials.

3. Contact the laminate manufacturer to check each batch of unqualified copper foil; request the recommended solution to remove the resin.

4. Ask the manufacturer of the laminate for removal methods. It is generally recommended to use hydrochloric acid and then remove it by mechanical grinding.

5. Contact the laminate manufacturer and use mechanical or chemical elimination methods.

6. Educate all process personnel to wear gloves to operate copper clad laminates. Determine whether the laminate has proper filling paper or is packed in a bag during transportation, and the sulfur content in the filling paper is low, and there is no dirt in the packaging bag. When using a cleaner containing silicon copper foil, make sure that no one touches it.

 

 

Shenzhen HOYOGO Electronic Technology Co., Ltd. is a manufacturer specializing in the production of high-precision double-sided, multi-layer and impedance, blind buried vias, thick copper circuit boards. The products cover HDI, thick copper, backplane, rigid-flex combination, buried capacity and resistance, gold finger and other circuit boards can meet customer needs for various products.

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