Welcome to visit Hoyogo website, let's connect the world together!
Customer service hotline:+86 13723413985 or 400 058 2288

Industry News

News

What are the Causes for Blistering on the PCB Board?

2021/09/09 18:10:36

Blistering is one of the common quality defects in PCB production process, because of the complexity of PCB manufacturing process, some blisters will occur. Do you know the causes of blistering on the PCB surface?

 

 

 

1. Some thinner substrates because of its poor rigidity, are not suitable for brushing with a brushing machine, so please pay attention to them during production and processing, So as not to cause the plate surface substrate copper foil and chemical copper between the poor bonding force caused by the surface blister.

 

 

2. The board surface is caused by oil stains during drilling, lamination, milling and other processing processes, or other liquids contaminate the surface with dust, which will also cause blistering on the board surface.

 

 

3. PTH electroplating has to go through a lot of chemical treatments, such as various acid-base inorganic, organic and other pharmaceutical solvents. This will not only cause cross pollution, but also cause the board poor local treatment of the board surface, generate bonding force and cause blistering on board surface.

 

 

4. During the pretreatment of PTH and pattern electroplating for micro-etching, if the micro-etching excessive will cause hole leakage of substrate, and cause blistering around the hole.

 

 

5. When the activity of the electroless plating copper solution is too strong, it will cause the deterioration of the physical properties of the coating and the poor bonding force, which is the phenomenon of blistering.

 

 

6. If the board surface is oxidized during the production process, it will also cause blistering on the board surface.

 

 

7. During the rework process of some PTH boards, blistering may occur on the board surface due to poor plating fading, incorrect rework methods, or improper control of the micro-etching time during the rework process.

 

 

8. If organic pollution occurs in the electroplating bath, especially oil pollution, it will cause blistering on the surface of the board.

 

 

The above are some of the reasons for the blistering of the PCB board. In the actual production process, there are many reasons for the blistering of the board. It is necessary to analyze the specific conditions and must not generalize.

 

 

HOYOGO is an international, professional and reliable PCB manufacturer, we have 2 PCB factory production bases. Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

TOP
(+86)-755-2300-1582
HOYOGO
HomeAbout UsProductsYourFocusPartnersQuotationsNewsContact Us